Applied Materials and Intel team up on AI-chip manufacturing R&D across transistors, interconnects and advanced packaging

What changed

Applied Materials announced an R&D collaboration with Intel on October 6 connecting Applied's EPIC Center in Silicon Valley with Intel's Oregon R&D campus. The work targets next-generation transistors, interconnects and advanced packaging, with the goal of shortening development cycles for semiconductor technologies needed by AI computing. This is a chipmaking and materials-engineering collaboration rather than a new AI model release, aimed at moving high-performance AI-chip process innovations toward manufacturing faster.